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Lead-free solder that can be selected according to the application.
It has gained attention in recent years as an environmentally friendly solder that does not contain harmful lead. SF-B Series Common Items Composition: Sn-Ag-Cu 99.0-0.3-0.7% Melting Point: 216-227℃ Wire Diameter: Φ0.6, Φ0.8, Φ1.0, Φ1.2mm Price: Open price
Equivalent peel strength to conventional eutectic solder. No-clean high-performance flux-containing solder.
There is no corrosion from the flux residue, and cleaning of the substrate is not necessary. The residue is non-hygroscopic and has excellent electrical insulation properties. It has good durability of activity and exhibits excellent wettability. It uses a special active rosin based on organic amines (non-chlorinated). Complies with JIS-AA grade and MIL-RMA standards.
Economical disposable size suitable for design and development! Easy to adjust the amount of solder.
The "SF-A5M03" is a lead-free solder from Taiyo Electric Industry Co., Ltd. that is recommended for soldering surface mount components. It comes in a small pack with a fine diameter of φ0.3mm and a length of 5m. The metal composition (in %) is Sn 96.5, Ag 3.0, Cu 0.5. 【Features】 ■ Suitable for surface mounting ■ Efficient 2.5g (5m) ■ RoHS2 compliant *For more details, please refer to the PDF document or feel free to contact us.
Achieve beautiful and highly reliable soldering! Excellent wettability.
Taiyo Electric Industry Co., Ltd.'s "Lead-Free Silver Solder Series" is a product that uses an alloy of Sn:Cu:Ni, recognized internationally by solder organizations. It excels in wetting and spreading, forming beautiful fillets, and has a short wetting time. By adding a small amount of Ni:Ge, it achieves a uniform surface gloss with fewer shrinkage cavities due to the fine effects of the crystals. 【Features】 ■ Control of copper erosion ■ Control of shrinkage cavities ■ Stable alloy layer ■ RoHS2 compliant *For more details, please refer to the PDF document or feel free to contact us.
Reduce the burden on the environment and the human body.
The reliability of the residue after soldering is excellent, and no-cleaning can be achieved. There are no intentional halogen components present. SF-N Series Common Items Composition: Sn-Ag-Cu 96.5-3.0-0.5% Melting Point: 217-220℃ Wire Diameter: Φ0.6, Φ0.8, Φ1.0mm Price: Open price
Lead-free solder series for industrial use, 500g rolls, without silver.
This is a silver-free, lead-free solder composed of tin, copper, nickel, and germanium. SF-C Series Common Items Composition: Sn-Cu-Ni-Ge, remainder - 0.7-0.05-0.01% or less Melting Point: 227℃ Wire Diameter: Φ0.6, Φ0.8, Φ1.0, Φ1.2, Φ1.6mm Price: Open price
